Cooling Fluids

■APPLICATION FIELDS

  • COMPUTING

    COMPUTING

  • INDUSTLIAL PROCESSES

    INDUSTLIAL PROCESSES

  • MOBILITY

    MOBILITY

  • HIGH POWER MANAGEMENT

    HIGH POWER MANAGEMENT

COMPUTING

  • DATACENTERS
  • CRYPTO & BLOCKCHAIN
  • SUPERCOMPUTERS
  • STOCK EXCHANGE SYSTEMS

INDUSTLIAL PROCESSES

  • DIELECTRIC TESTING
  • FREEZE-DRYING
  • SEMICON ETCHING

MOBILITY

  • CHARGING STATIONS
  • BATTERY SYSTEMS
  • ELECTRIC MOTORS
  • CONTROLLERS
  • BRAKING SYSTEMS

HIGH POWER MANAGEMENT

  • CONVERTERS & INVERTERS
  • LASERS & POWER LEDS
  • MEDICAL SCANNERS
  • MILITARY INSTALLATIONS

THERMASOLVTM

RECOMMENDED PRODUCTS

Each product has specific parameters in order to suit best your application and process.
Our team is ready to help you to select the right product.

THERMASOLVTM IM1

Dielectric heat transfer fluid

  • Hydrofluoroether based(HFE)
  • Dedicated for 2-phase systems(boiling point:61℃ / 142°F)
  • Medium low GWP

THERMASOLVTM IM2

Dielectric heat transfer fluid<

  • FluoroKetone based(FK)
  • Dedicated for 2-phase systems(boiling point:49℃ / 120°F)
  • No GWP

THERMASOLVTM IM6

Dielectric heat transfer fluid

  • Fluoro Olefine based(FO)
  • Dedicated for 2-phase systems(boiling point:47℃ / 116°F)
  • Ultra Low GDP

THERMASOLVTM IM7

Dielectric heat transfer fluid

  • Hydrofluoroether based(HFE)
  • Dedicated for 1-phase or 2-phase systems(boiling point:76℃ / 169℉)
  • Low GDP

THERMASOLVTM CF1

Dielectric heat transfer fluid

  • Polyfluorene polymer based
  • Dedicated for 1-phase systems(boiling point:170℃ / 338°F)
  • High GWP

THERMASOLVTM CF2

Dielectric heat transfer fluid

  • Polyfluorene Alcene based
  • Dedicated for 1-phase systems(boiling point:110℃ / 230°F)
  • Low GDP

THERMASOLVTM CF3

Dielectric heat transfer fluid

  • Perfluoroepoxyde based
  • Dedicated for 1-phase systems(boiling point:120℃ / 248°F)
  • Low GDP

3 MAIN PROCESSES

  1. IMMERSION COOLING(1-PHASE / 2-PHASE)
    Electronic boards, components or devices are immersed in a dielectric fluid where heat from the components is transferred to the fluid. Pumps are used to flow the heated fluid to a heat exchanger.
    In 2-Phase immersion cooling, fluid is boiled and condensed, increasing substantially heat transfer efficiency.
  2. DIRECT COOLING
    The fuild is pumped through cold plates attached to electronic components or through cooling tubes to take away the heat. The electronics are never in contact with the fluids. The heated fluid can be cooled in a 1 or 2-phase system.
  3. DIELECTRIC TESTING & MANUFACTURING
    The cooling fluid is used for dielectric testing or to cool critical manufacturing processess in the semicon and pharma industry.

Products inquiries, Documents request